OPTICS 2016

In Conjunction with Design, Automation & Test in Europe Conference
18th March 2016, Dresden, Germany

General Chairs

Gabriela Nicolescu, Polytechnique Montréal
Jiang Xu, Hong Kong University of Science and Technology
Sébastien Le Beux, Ecole Centrale de Lyon

Program Chair

Mahdi Nikdast, Polytechnique Montréal

Speakers

Marc Seifried, IBM Research Lab
Ruping Cao, Mentor Graphics Corp
Sebastien Cremer, STMicroelectronics
Akihiko Shinya, NTT Basic Research Lab
Sebastien Rumley, University of Columbia
Josè Flich, Universidad Politecnica de Valencia
Alan Mickelson, University of Colorado at Boulder
Ian O'Connor, Lyon Institute of Nanotechnology
Daniel Chillet, INRIA - University of Rennes 1
Isabella Cerutti, Scuola Superiore Sant'Anna
Nikos Hardavellas, Northwestern University
Mahdi Nikdast, Polytechnique Montréal
Davide Bertozzi, University of Ferrara
Ayse Coskun, Boston University
Yoan Léger, CNRS – FOTON
Jiang Xu, HKUST

Final Program

08:30 Introduction to OPTICS workshop
Sébastien Le Beux and Mahdi Nikdast

Morning Session I: What is New on the Technology Side?
Chair: Sébastien Le Beux

08:40 Towards Next Generation of Silicon Photonics Technology [slides]
Sebastien Cremer, STMicroelectronics

09:10 Laser Integration Challenges for On-Chip Optical Interconnects [slides]
Yoan Léger, CNRS – FOTON

09:30 Electro-Optical Integration of III-V-on-Silicon for Efficient On-Chip Laser Sources [slides]
Marc Seifried, IBM Research Lab

09:50 Integrated Nanophotonics for fJ/bit On-Chip Optical Communications [slides]
Akihiko Shinya, NTT Basic Research Lab

10:10 Selective Coupling Functionalities for On-Chip Mode-Division Multiplexing [slides]
Alberto Parini, Yann Boucher, Christophe Peucheret

10:15 PhoNoCMap: an Application Mapping Tool for Photonic Networks-on-Chip [slides]
Edoardo Fusella, Alessandro Cilardo

10:20 OptiShare: a Dynamic Channel Sharing Scheme for Power Efficient On-Chip Optical Architectures [slides]
Eldhose Peter, Smruti R Sarangi

10:25 Synthesis of Optical Circuits with Contradictory Optimization Objectives [slides]
Arighna Deb, Robert Wille, Oliver Keszöcze, Stefan Hillmich, Rolf Drechsle

10:30 Coffee Break and Poster Session

Morning Session II: Bringing Optical Communication into the Chip
Chair: Mahdi Nikdast

11:00 Optical Interconnections and Power Consumption in Cloud Computing [slides]
Alan Mickelson, University of Colorado at Boulder

11:20 Communication Requirements Inside a Chip [slides]
Josè Flich, Universidad Politecnica de Valencia

11:40 Modeling and Analysis of Off-Chip Optical and Electrical Interconnects and Interfaces [slides]
Jiang Xu, Hong Kong University of Science and Technology

12:00 Lunch Break and Poster Session

Afternoon Session I: Silicon Photonic Interconnect Management
Chair: Jiang Xu

13:00 Impact of High-Speed Modulation on the Scalability of Silicon Photonic [slides]
Sebastien Rumley, University of Columbia

13:30 Towards Energy-Proportional Optical Interconnects [slides]
Nikos Hardavellas, Northwestern University

13:50 Design Space Exploration of Optical Interfaces for Silicon Photonic Interconnects [slides]
Daniel Chillet, INRIA - University of Rennes 1

14:10 Thermal Management of Manycore Systems with Photonic NoCs [slides]
Ayse Coskun, Boston University

14:30 Coffee Break and Poster Session

Afternoon Session II:  Design Methods and Challenges
Chair: Sébastien Le Beux

15:00 Network-on-Chip Using Silicon Photonics Waveguide Arrays [slides]
Isabella Cerutti, Scuola Superiore Sant'Anna

15:20 Enabling Silicon Photonics Technology with EDA [slides]
Ruping Cao, Mentor Graphics

15:40 Fabrication Non-Uniformity in Silicon Photonic Interconnects [slides]
Mahdi Nikdast, Polytechnique Montréal

16:00 Layout Design of Wavelength-Routed Optical NoCs: the Global Picture [slides]
Davide Bertozzi, University of Ferrara

16:20 Thermal Aware Design Method for On-Chip Optical Interconnect [slides]
Ian O'Connor, Lyon Institute of Nanotechnology

16:40 Panel discussion
Moderator:
Jiang Xu, Hong Kong University of Science and Technology
Panelists:
Yoan Léger, CNRS – FOTON
Sebastien Cremer, STMicroelectronics
Sebastien Rumley, University of Columbia
Alan Mickelson, University of Colorado at Boulder

17:10 Concluding remarks
Jiang Xu, Hong Kong University of Science and Technology